Technical Areas

The RFIT2025 invites papers in the following technical areas, but are not limited to the following technical areas.

A. EM Field, Design and Measurement Techniques

• Modeling and CAD: active/passive device modeling, CAD, EM simulation, co-simulation

B. Passive Components and Packaging

• Packaging Technologies: 3D, chiplet, MCM, SiP, TSV, flip chip assembly, wire bonding, anisotropic conductive film, additive manufacturing
• Passive Circuits and Antennas: on-chip antennas, integrated passive devices, ferrite, piezoelectric

C. Active Devices and Circuits

• Device Technologies: CMOS, SOI, LDMOS, SiGe, GaAs, InP, GaN, MEMS, reliability, characterization
• Frequency Generation/ Conversion ICs: VCOs, PLLs, synthesizers, dividers/multipliers/ mixers
• Front-end RFICs: LNAs, VGAs, phase shifters, RF switches
• Power ICs: power amplifiers, linearization circuits, drivers

D. Systems and Applications

• Analog and Mixed Signal ICs: ADC, DAC, comparators, filters, AGC/VGA
• High-Speed Data Transceivers: wireless/wireline/optical transceivers, CDRs for data links.
• Power Transmission ICs: RFID, electromagnetic induction, wireless power transmission ICs
• Radio Integrated Systems: IoT M2M, automotive radars, wearable devices, security, biomedical and healthcare applications
• 5G/B5G/6G Systems: MIMO systems, smart radio systems, cube satellite and satellite communication systems
• RF Sensor ICs: automotive radars, wearable devices, security, biomedical and healthcare applications

 E. Emerging Technologies

• Millimeter-wave and THz ICs: circuits operating at mm-wave and THz bands
• Emerging ICs: power management, digital RF circuits, RF BIST, reconfigurable ICs, vehicle electronic ICs
• Cryogenic technologies: cryogenic/quantum devices and modelings, cryogenic circuits, systems, measurement techniques, and quantum computing
• AI/Machine Learning for RF/MW/mmW: AI/ML, algorithms implementations, and demonstrations for: spectrum sensing; mobile edge networking; MIMO and array beam operations and management; design and optimization; in-situ sensing, diagnostics, control, reconfiguration of MHz to THz communication and sensing circuits and systems

Paper Submission

To encourage timely reporting of the latest results and have better opportunities to expand papers for possible journal publications, prospective authors are invited to submit a 3-page manuscript (both initial submission and final manuscript, if accepted) in English and in IEEE PDF eXpress format. The manuscript should emphasize original contributions and key findings, including figures, diagrams and results from both simulations and measurements. References should be clearly cited and up-to-date. Accepted conference papers can be submitted for inclusion into IEEE Xplore subject to meeting IEEE Xplore's scope and quality requirements. By submitting a manuscript, the authors agree that, if accepted, at least one of the authors will make a full registration and attend the RFIT2025 to present their paper.  All must be made through the RFIT2025 website: www.rfit2025.org

Author Instructions

Initial paper submissions
It is requested that authors submit an English, A4-size THREE-page preliminary paper based on the IEEE conference word or LaTeX templates. Papers should be uploaded in PDF format. It is imperative to note that all submitted papers will undergo a peer-review process. The Technical Programme Committee (TPC) will make the final decision, and accepted papers will be designated as either oral or poster presentations.

Final paper submissions
Authors should check PDF compatibility at IEEE PDF eXpress before submission. (Details for the PDF check compatibility will be provided soon) Final papers should be up to three pagers in English. Final papers will be uploaded to IEEE Xplore if their authors will be presenting at the conference.

Submission Policies
IEEE mandates that authors submit original work that has neither been published elsewhere nor is under review for another publication. Authors are required to disclose any prior publications and current submissions when submitting an article. This ensures the integrity of the publication process and avoids issues related to multiple submissions or prior publication.

Authors instructions for final paper preparation and submission New!

It is mandatory that at least one author for each accepted paper is fully registered (as a regular or as a student participant). The registration fee allows to submit and present a maximum of TWO papers for any author with a REGULAR registration and a with maximum of ONE paper for any author with a STUDENT registration.

Final Paper Preparation

• The final manuscript must comply with the IEEE rules for style by using the IEEE template (A4 size) for conference proceedings available at https://www.ieee.org/conferences/publishing/templates
• Authors are requested to improve their manuscript using the corresponding comments and suggestions from the reviewers.
• Final manuscript should be up to THREE pages in length.
• Authors are requested to check that the PDF version of the final manuscript is IEEE compliant using IEEE PDF eXpress before submission.
  • PDF eXpress website can be found at https://ieee-pdf-express.org/.
  • The conference ID for PDF eXpress is 65667X.

Final Paper Submission

• Authors log-in into the EDAS system and select “My papers”.
• Complete the copyright form by clicking on the “©” button below the paper status.
• You must submit your IEEE copyright form using the IEEE electronic copyright mechanism. EDAS will auto-direct the authors to the eCF site to complete the copyright transfer.
• Upload the final manuscript which has already checked by the PDF eXpress.
• Final manuscript uploading must be done until June 27th (New York Time).

Please note that IEEE reserves the right to exclude a submission from distribution after the conference, including exclusion from IEEE Xplore®, if the submission does not meet IEEE standards or if it is not presented at the conference. Articles excluded from further distribution shall be archived by IEEE but shall not be indexed or appear on IEEE Xplore®. Authors also find the IEEE Guidelines & Policies in detail. ( https://conferences.ieeeauthorcenter.ieee.org/author-ethics/guidelines-and-policies/)

Future engineers —Get Together—

We welcome high school students from the local area who are interested in the fields of microwaves and semiconductors. Graduate or undergraduate students will guide them to attend technical sessions and poster sessions. High school students, assisted by university students, will participate in technical session/poster session and discussion with presenters. In addition, high school students will be invited to a lunch meeting where they can interact with engineers and researchers working on a global scale. This activity will take place at the 2025 IEEE International Symposium on Radio-Frequency Integration Technology.

We are inviting students from the "Super Science High School" in the Kagoshima area, which is recognized by the Japanese government. This event will be supported by TC-9 and Kagoshima Prefectural Board of Education.

Schedule
1000–1100 Poster session
1100–1200 Interaction with graduate/undergraduate students
1200–1300 Lunch meeting with world class engineers/researchers
1500–1600 Poster session